For semiconductor producing processes, some procedures need hot UPW to clean the wafers.
Generally there are two ways to generate hot UPW: Central Hot UPW supply system ; Local DI heater.
For Winbond, we adapt Central Hot UPW supply system and this is the first time we introduce heat pump equipment to Hot DI System.
By Heat Pump equipment , we can reduce the natural gas usage and cooling system energy usage at the same time and save huge carbon emission.
Using operational data from the Hot UPW system to create key performance indicators (KPIs) for for adjusting machines to reduce energy consumption.